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特徴:
●Planar Die Construction
●350mW Power Dissipation on Ceramic PCB
●General Purpose, Medium Current
●Ideally Suited for Automated Assembly Processes
●Available in Lead Free Version
http://ja.misuxin-en.com/
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特徴:
●Planar Die Construction
●350mW Power Dissipation on Ceramic PCB
●General Purpose, Medium Current
●Ideally Suited for Automated Assembly Processes
●Available in Lead Free Version
http://ja.misuxin-en.com/
